BGA packaged chip
The GPU, chipset, or other controller connects to the card via a package structure located on its underside, using the connection ports.
Reballing, Chip Removal and Assembly, and Heat Profiling.
Beylikdüzü BGA Rework Service and Controlled Reballing Process
Beylikdüzü BGA rework servicethe requirements for disassembly, pad preparation, solder ball replacement, controlled assembly, and post-processing load testing of BGA-packaged GPUs, chipsets, and similar chips based on technical findings.
BGA processing is not a solution for every display or motherboard failure. Before deciding on rework, the chip power supplies, BIOS, RAM, display cable, PCB damage, and the possibility of chip failure itself should be considered.
Fault verification
The possibility of a chip connection is separated from other display and power failures.
Controlled disassembly
The PCB and its peripheral components are separated from the chip board.
Pad preparation
The card and chip surfaces are inspected for solder residue and pad damage.
Reballing and assembly
New solder balls are applied, and the chip is realigned and reassembled.
Load test
The display, driver, temperature, and long-term stability are all monitored.
BGA Package Structure
How do you connect a BGA chip to a motherboard?
In BGA-packaged chips, electrical connections are transferred to the motherboard pads via numerous solder balls located beneath the chip. Because the connections are located beneath the chip, they cannot be directly accessed using standard soldering methods .
Solder balls
Solder balls, which provide the electrical and mechanical connection, are applied under the chip with a specific diameter and arrangement.
PCB pads
are connected to the data, power, and control lines within the multilayer PCB .
Thermal process
, a controlled temperature-time curve suitable for the board, chip, and solder alloy is required.
Reflow, Reballing, and Chip Replacement
The three operations do not mean the same thing.
The choice of repair method should depend on whether the fault is in the solder joint, within the chip itself , or on the PCB.
Reflow
is the process of reheating existing solder joints without removing the chip. Reflowing without verifying the fault can create temporary contact and mask the actual problem.
Reballing
The chip is removed from the board, old solder residue is cleaned, new solder balls are applied, and the chip is reassembled in a controlled manner.
Chip replacement
If the chip's own silicon structure is faulty, simply replacing the connections won't be enough. Replacement with a compatible and functional chip will be considered.
Reballing is only meaningful for connection-related failures. It may not yield the same results for internal chip failures or PCB pad damage .
BGA Transaction Decision
Which findings support the possibility of rework?
The following symptoms alone are not proof of a BGA failure. However , persistent symptoms despite adequate power, BIOS, RAM, video output, and chip power supplies strengthen the need for a rework.
Observed symptom
Those that need to be separated first
Meaning from the BGA perspective
No image or image is distorted.
RAM, BIOS, panel, cables, external outputs, GPU power supplies.
If other areas are healthy, a chip/connection check is performed.
The system crashes when the driver is loaded.
Driver, operating system, VRAM, temperature, and power line.
GPU or peripheral connections are evaluated under load.
The image cuts out when it gets hot.
Cooling system, power circuit, sensor and thermal contact.
The possibility of a connection altered by thermal expansion is investigated.
Artifact or discoloration occurs.
VRAM, cable, panel, GPU power supply, and software.
Chip or memory connections are isolated using load testing.
It previously worked temporarily when heat was applied.
Previous temperature, time, card bending, and pad condition.
It can support the possibility of a connection, but the risk of damage increases.
Chip feeds are not occurring.
The regulator, enable signal, short circuit, and BIOS startup process.
The priority is the power or control circuit, not the BGA.
BGA Rework Application Steps
How does the chip removal and reassembly process work?
the board structure, chip size, peripheral components, and solder alloy vary, a single temperature setting cannot be applied to all devices. The board's previous condition is also evaluated before the process begins.
01
PCB and peripheral component inspection
The board is inspected for bending, missing components, epoxy, previous heat traces, pad damage, and sensitive parts surrounding the chip.
02
Underheating and temperature increase
To avoid sudden temperature differences across the entire motherboard, appropriate preheating and gradual temperature increase are applied.
03
Controlled removal of the chip.
When the solder reaches the melting point, the chip separates from the board without forcing the pads and PCB layers.
04
Preparation of chip and card pads.
Old solder residue is cleaned; broken, lifted, or oxidized pads are evaluated before the process continues.
05
Application of new solder balls
using a stencil, solder ball diameter, and alloy suitable for the chip package .
06
Alignment and reassembly
Chip orientation and centering are verified; solder balls are bonded to pads under controlled profiling.
07
Controlled cooling and visual inspection.
The card is not cooled down suddenly. After cooling, the chip alignment, surrounding components, and processing area are checked.
Controlled Heat Profile
In BGA processing, only the highest temperature is not important.
includes how long it takes for the temperature to rise, which areas of the board get hottest and how long the solder remains in the liquid phase, and its cooling behavior.
Preheating
It reduces the temperature difference between the PCB layers and helps prevent the overhead heat source from suddenly stressing the board.
Balancing zone
To reduce the temperature difference between the board and components, a controlled waiting period is applied at specific intervals.
Solder melting area
The appropriate temperature and time are monitored to match the melting behavior of the solder alloy used; unnecessarily long periods at high temperatures are avoided.
Controlled cooling
Rapid and uneven cooling is carried out in a controlled manner because it can cause board warping and create new mechanical stress.
A single temperature reading obtained from the internet is not suitable for all boards. Board thickness, chip size, leaded/lead-free solder, subfloor, and surrounding components all alter the profile decision.
Pad and PCB Inspection
The process may not continue after the chip is removed.
The true condition of the PCB under the chip can only be determined after desoldering. If pad loss, carbonization, or multilayer line damage is observed, reballing may not be technically feasible.
Lifted or detached pad
the electrical connection between the chip and the PCB can be re-established depends on the pad's function and the substrate connection.
Carbonized PCB area
Excessive heat or short circuits can cause carbonization in the circuit board area, leading to leaks and making reassembly impossible.
Previous scraping and line intervention
Previous pad scraping, jumper installation, or improper soldering can affect alignment and connection quality.
Chip bottom epoxy or underfill
changes the risk of removal and the applicable method.
Card bending
PCBs exposed to uncontrolled heat can lose their flatness; this can prevent even contact between the solder balls.
Environmental component loss
any small resistors and capacitors in the disassembly area are missing or dislodged.
Reballing or Chip Replacement?
Replacing the solder balls is not enough to fix a chip failure.
Reballing repairs connections; it does not repair silicon, memory controller, or other internal circuitry failures within the chip. This distinction is important for accurately establishing expectations before the process begins.
Reballing can be considered.
- If the fault is consistent with the chip-under-connection behavior
- If the chip power supplies and peripheral circuits are normal
- If PCB pads are suitable for the process
- If there is no apparent physical damage to the chip
- If the previous heat treatment didn't severely damage the card
Chip replacement or transaction rejection may be considered.
- If the chip is faulty internally
- If a compatible and functional chip needs to be supplied
- If PCB pad or layer damage cannot be repaired
- If it excessively increases the risk of chip-under epoxy removal
- If the transaction cost and technical risk are not economical
Uncontrolled Heat Interventions
Why do heat gun or oven treatments make subsequent repairs more difficult?
the temperature, duration, and location of the card's exposure are unknown, invisible damage can occur to the PCB, chip, and peripheral components .
PCB bending and layer damage.
Unstable temperatures can damage the mechanical structure of the card and create stress in multi-layered connections.
Joining of solder balls
Uncontrolled heat can cause the solder balls under the chip to come closer together or create a short circuit.
Displacement of surrounding components
Small passive components can slide onto the molten solder or detach from the board.
Weakening of the pads
Repeated exposure to high heat can increase the likelihood of pads separating from the PCB during chip removal .
Thermal damage to the chip
can permanently affect not only the connections but also the chip package and its internal structure.
Temporary employment can be misleading.
The fact that the device operates briefly after heating does not necessarily mean the fault has been resolved or that reballing will definitively fix it.
the device has previously undergone reflow, heat gun, oven, or other BGA processing, information regarding temperature, duration, and the process performed must be shared before the technical inspection.
Situations Where BGA Treatment Should Not Be Performed
Not every process that seems technically possible is feasible.
The card structure, chip availability, previous modifications, and the economic value of the device are all considered together. In some cases, not performing the procedure is the more appropriate outcome.
If the fault is not related to BGA
a power line, BIOS, RAM, panel, or other component failure is confirmed.
If the PCB is severely damaged
extensive burning, carbonization, layer separation, or multiple pad loss, a proper installation may not be possible.
If a compatible chip is not available
If the chip itself is faulty and a suitable part is unavailable, reballing will not solve the problem.
If previous heat damage was high
If the card or chip has previously been exposed to excessive temperatures, the risk of reprocessing may be above an acceptable level.
If the underlying filling structure is unsuitable
Underfill or special packaging structures on some chips can increase the risk of PCB and chip damage during disassembly.
If it has no economic value
If the cost of the procedure, the cost of the chip, and the resulting risk are not feasible relative to the value of the device, an alternative solution will be considered.
Post-Treatment Testing
BGA rework is not completed simply by turning on the device.
The connection problem may reappear under load. Therefore, image, driver, temperature, and stability controls should be applied according to the device's intended use .
Cold and hot opening
of the device is compared when it is completely cold and after it has reached its operating temperature .
Image and driver control
Resolution, external output, driver loading, and image stability are checked.
Temperature under load
The GPU or related chip is operated under load to monitor temperature, frequency, and shutdown behavior.
Long-term stability
freezing, artifacts, driver crashes, restarts, and loss of display .
The test duration may vary depending on the device's fault history. A short boot-up test is insufficient for boards that have previously failed due to overheating or displayed intermittent images .
Beylikdüzü BGA Acceptance Point
Paradise AVM's BGA rework evaluation
Please share your complete transaction history.
KTeknik Servis performs BGA rework evaluations at its Paradise AVM service point in Adnan Kahveci Mahallesi. Information regarding the device or board model, fault symptoms, whether reflow/reballing has been previously applied, liquid contact, and heat damage is crucial for the evaluation.
Address
Adnan Kahveci Neighborhood, Yavuz Sultan Selim Boulevard, Paradise AVM No:16, Shop:10, Beylikdüzü / Istanbul
Frequently Asked Questions
Frequently asked questions about Beylikdüzü BGA rework service.
Does BGA rework fix every image quality issue?
No. RAM, BIOS, panel, display cable, power line, VRAM, and software issues can also cause display malfunctions. The decision regarding BGA should be made after ruling out other possibilities.
Are reflow and reballing the same process?
No. Reflow reheats existing solder joints without removing the chip. In reballing, the chip is removed, the solder balls underneath are renewed, and then it is reassembled.
Is reballing a permanent solution?
If the fault is truly caused by the under-chip connections, reballing might be a suitable solution . Reballing won't suffice for internal chip failures or PCB damage .
What to do if the chip is faulty?
Chip replacement can be considered if a compatible and functional chip is available . If a suitable chip is not available or the PCB is damaged, the procedure may not be performed.
Can reballing be done on a card that has previously been treated with a heat gun?
First, the card bending, pad condition, surrounding components, and any damage the chip has sustained are assessed. Previous uncontrolled heat treatment can increase the risk.
Which solder ball is used in BGA processing?
Solder ball diameter and alloy are selected according to the chip package, board structure, and manufacturing specifications. The same diameter is not used for every chip.
What tests are performed after BGA treatment?
Cold and hot start-up, display, driver, external output, temperature, operation under load, and long-term stability controls are implemented.
Does the BGA process affect the data on the device?
The procedure is not directly aimed at the storage unit; however, data integrity in faulty devices poses a separate risk. If there is important data, it must be clearly stated before the procedure.
Relevant Technical Sheets
For failure areas other than BGA, please go to the correct page.
This page is only for BGA package chip operations. For general motherboard, device, or display malfunctions, please use the relevant technical datasheet.
Please share the BGA process history and the symptom of the failure.
the device or card model, display behavior, any symptoms that occur when it heats up, and any previously applied reflow, reballing, or heat treatments via WhatsApp. The exact process and cost information will be shared after the technical inspection of the card is completed.
Paradise AVM No:16 Shop:10 — Adnan Kahveci Neighborhood, Beylikdüzü / Istanbul